GrandTwin A+ Server AS-2116GT-HNTF

DEMAND_AS-2116GT-HNTF
DEMAND_AS-2116GT-HNTF
DEMAND_AS-2116GT-HNTF
DEMAND_AS-2116GT-HNTF
DEMAND_AS-2116GT-HNTF
DEMAND_AS-2116GT-HNTF
  • Form Factor 2U Rackmount
  • Supported CPUs AMD EPYC 9004
  • AMD EPYC 9005
  • CPU Sockets 4
  • Max Supported Memory
    16 TB  DDR5  ECC Supported
  • Drive Bays 4 front hot-swap 2.5" NVMe/SATA Hot swap 2.5" Drive Bays
  • Power Supply
    2200 W  Titanium  Redundant

Key Applications

  • HPC (High Performance Computing)
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • Telco Edge Cloud
  • EDA (Electronic Design Automation)

Key Features

  • Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  • Single Socket SP5 AMD EPYC™ 9005 / 9004 Series Processors up to 500W with air cooling
  • Up to 16 DIMMs, 5200 MT/s, 2 TB DDR5 memory in 1DPC
  • (Please check System Memory Section for detail)
  • Flexible networking with AIOM support
  • Total of 4 front hot-swap 2.5″ NVMe / SATA drive bays
  • Dual 2200W Redundant (1+1) Titanium Level (96%) power supplies
  • (Power supply full redundancy based on configuration and application load)

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More Specifications

  • Configurable  Configurable by Request
  • Cores up to  192
  • TDP  400 W
  • M.2  2 NVMe M.2 slot Per Node
  • PCI-e  Default: 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible) Per Node
  • Dimensions  17.67" (449 mm) Width
  • Dimensions  28" (711.2 mm) Depth
  • Dimensions  3.46" (88 mm) Height
  • Product Model  AS-2116GT-HNTF
  • LAN  1 RJ45 1 GbE
  • NVMe  2 Per Node
  • USB  2 USB 3.0 ports Per Node
  • Video Output  1 VGA port Per Node
  • DIMM Type  RDIMM
  • Chipset  System on Chip
  • On-board NVMe  4 NVMe / SATA Per Node
  • Operating Temperature  10°C ~ 35°C (50°F ~ 95°F)