GrandTwin SuperServer SYS-212GT-HNF
- Form Factor 2U Rackmount
- Supported CPUs Intel Xeon 6500 P-cores
- Intel Xeon 6700 E-cores
- Intel Xeon 6700 P-cores
- CPU Sockets 4
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Max Supported Memory
16 TB DDR5 ECC Supported
- Drive Bays 8 front hot-swap E1.S PCIe 5.0 x4 NVMe* Hot swap E1.S NVMe
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Power Supply
3000 W Titanium Redundant
Key Applications
- Enterprise Applications
- Scale-Out Object Storage
- Cloud Computing, Compact Server
- Web / Hosting Application
- Cloud Gaming
- MEC (Multi-Access Edge Computing)
- Multi-Purpose CDN
- Telco Edge Cloud
- Mission Critical Web Applications
- IoT Edge Computing / Gateway
- Edge AI Inferencing
Key Features
- Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Highly configurable 2U 4-Node front access nodes for cold aisle serviceability with up to 8 × E1.S NVMe drives per node
- 1 PCIe 5.0 ×16 LP slot (offered with 4 × E1.S drives), or 1 OCP 3.0 slot (offered with 2 × U.2 drives) for networking expansions
- GrandTwin front I/O module offers additional networking options (10G / 25G / 200G) with NCSI support
- Single-Socket Intel® Xeon® 6 6700 series processors
- 16 DIMM slots supporting up to 4 TB of memory; ECC RDIMMs up to DDR5-6400
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More Specifications
- Configurable Configurable by Request
- Cores up to 144
- TDP 350 W
- M.2 2 NVMe M.2 slot Per Node
- PCI-e Default*: 1 PCIe 5.0 x16 LP slot Per Node
- Dimensions 17.67" (449 mm) Width
- Dimensions 28" (711.2 mm) Depth
- Dimensions 3.46" (88 mm) Height
- Product Model SYS-212GT-HNF
- LAN 1 RJ45 1 GbE Per Node
- NVMe 8 Per Node
- USB 2 USB 3.0 ports Per Node
- Video Output 1 VGA port Per Node
- DIMM Type RDIMM
- Chipset System on Chip
- On-board NVMe NVMe
- Operating Temperature 10°C ~ 35°C (50°F ~ 95°F)