BigTwin SuperServer SYS-222BT-HNR

DEMAND_SYS-222BT-HNR
DEMAND_SYS-222BT-HNR
DEMAND_SYS-222BT-HNR
DEMAND_SYS-222BT-HNR
DEMAND_SYS-222BT-HNR
DEMAND_SYS-222BT-HNR
  • Form Factor 2U Rackmount
  • Supported CPUs Intel Xeon 6500 P-cores
  • Intel Xeon 6700 E-cores
  • Intel Xeon 6700 P-cores
  • CPU Sockets 8
  • Max Supported Memory
    16 TB  DDR5  ECC Supported
  • Drive Bays Default: 6 front hot-swap 2.5" PCIe 5.0 NVMe Hot swap 2.5" Drive Bays
  • Power Supply
    3600 W  Titanium  Redundant

Key Applications

  • All-Flash NVMe Hyperconverged Infrastructure
  • Container-as-a-Service; Application Accelerator
  • High-Performance File System
  • Diskless HPC Clusters

Key Features

  • Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  • Dual Socket E2 (LGA-4710) Intel® Xeon® 6700 / 6500 series processors with P-cores or 6700 series processors with E-cores up to 205W with air cooling or 350W with liquid cooling
  • Up to 16 DIMMs supporting up to 4 TB DDR5-6400 in 1DPC
  • Flexible networking with up to 1 OCP 3.0 compatible AIOM slot
  • Up to 2 PCIe 5.0 ×16 LP + 1 PCIe 5.0 ×16 AIOM slots
  • Up to 6 front hot-swap 2.5″ NVMe drive bays
  • 2 Redundant 3600W Titanium Level power supplies
  • 2U Rackmount chassis with 28.75″ (730 mm) depth

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More Specifications

  • Configurable  Configurable by Request
  • Cores up to  144
  • TDP  350 W
  • M.2  2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110) Per Node
  • PCI-e  Default: 2 PCIe 5.0 x16 LP slots Per Node
  • Dimensions  17.68" (449 mm) Width
  • Dimensions  28.75" (730 mm) Depth
  • Dimensions  3.47" (88 mm) Height
  • Product Model  SYS-222BT-HNR
  • LAN  1 RJ45 1 GbE
  • NVMe  6 Per Node
  • USB  2 USB 3.0 Gen2 Type-A ports(Rear) Per Node
  • Video Output  1 VGA port Per Node
  • DIMM Type  RDIMM
  • Chipset  System on Chip
  • Operating Temperature  10°C ~ 35°C (50°F ~ 95°F)